Senior Process Development Engineer
Company: Approach Venture
Location: Los Angeles
Posted on: December 30, 2025
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Job Description:
Job Description Job Description Senior Process Engineer – Help
Pioneer the Future of Optical Computing Hardware! Gardena, CA |
Onsite Opportunity Summary A well-funded stealth startup is
developing breakthrough optical computing hardware designed to
surpass the limitations of traditional electronics. Backed by
experienced founders and early-stage investors, the team is
combining advanced photonics, packaging, and manufacturing under
one roof. We’re looking for a Senior Process Engineer to lead key
development efforts in wafer and die-level packaging. This role is
hands-on, highly technical, and central to launching our first
product. About Us We’re an ambitious group of engineers,
scientists, and builders focused on optical computing innovation.
Our startup combines experience from previous frontier tech
ventures with a shared mission to redefine how light is used in
computational systems. With early funding secured, we're building
both the hardware and the factory floor to scale it, developing
vertically integrated systems that blend photonics, electronics,
and manufacturing into a cohesive, next-generation computing
platform. Job Duties Develop and own process recipes for
wafer-level and die-level packaging techniques, including eutectic
bonding, flip-chip attachment, underfill, and protective coatings
Achieve high-yield bonding (>99.9%) and ensure thermal
reliability through 20,000 cycles Analyze failure mechanisms using
X-ray, SAM, SEM/TEM, shear testing, and other methods, feeding
results back into process and design improvements Lead the
transition of R&D processes into repeatable, high-volume
production workflows using SPC and tool selection methodologies
Serve as technical lead for corrective actions stemming from root
cause analysis and field data Collaborate across design,
electrical, and mechanical engineering teams to fine-tune packaging
architecture Support hiring efforts and mentor junior engineers to
grow internal manufacturing capabilities Qualifications MS or PhD
in Materials Science, Electrical Engineering, Chemical Engineering,
or a related field 3 years of hands-on experience in semiconductor
process development or advanced packaging Proven track record
developing and qualifying bonding processes such as eutectic,
flip-chip, or hybrid methods Strong command of statistical quality
control practices and continuous improvement strategies Comfortable
working in a fast-paced lab and production environment, including
extended hours when needed Preferred Experience Background in
nanofabrication techniques (e-beam lithography, dry etch, PECVD,
CMP) Experience integrating photonic components such as SiPh or InP
into electronic packages Prior work with optoelectronic device
packaging or hybrid integration Why Join Us High-impact opportunity
at the forefront of photonics and next-gen computing Seed-funded
startup with ambitious growth plans and hands-on technical
leadership Early-stage equity and long-term incentive plans
Flexible work culture and strong support for innovation Relocation
assistance to Southern California Comprehensive health coverage:
medical, dental, and vision Paid parental leave, flexible vacation
policy, and company holidays Compensation Details $120,000 -
$200,000 plus equity LI-AV
Keywords: Approach Venture, Burbank , Senior Process Development Engineer, Engineering , Los Angeles, California